Feibiao Chen
13Patents
1h-index
21Co-inventors
43Inventor score
Filing activity: Dec 24, 2014 → Aug 9, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10040717B1 | Thick-film paste with multiple discrete frits and methods for contacting crystalline silicon solar cell emitter surfaces | Emerging Cross-Sectional Technologies | 1 | Active |
| US10658327B1 | Chip bonding apparatus and bonding method | Electricity | 1 | Active |
| US10748800B2 | Chip bonding apparatus and method | Electricity | 1 | Active |
| US10763235B2 | Batch bonding apparatus and bonding method | Electricity | 0 | Active |
| US9857702B2 | Focusing leveling device | Physics | 0 | Active |
| US10274840B2 | Adaptive groove focusing and leveling device and method | Physics | 0 | Active |
| US11081380B2 | Chip bonding device | Electricity | 0 | Active |
| US10197923B2 | Exposure device and out-of-focus and tilt error compensation method | Electricity | 0 | Active |
| US10656507B2 | Focusing and leveling measurement device and method | Physics | 0 | Active |
| US10903105B2 | Flip chip bonding device and bonding method | Emerging Cross-Sectional Technologies | 0 | Active |
| US11037900B2 | Chip bonding device and bonding method thereof | Electricity | 0 | Active |
| US10770320B2 | Universal chip batch-bonding apparatus and method | Electricity | 0 | Active |
| US11551948B2 | Semiconductor manufacturing apparatus | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.