Method for manufacturing an electronic device
US11551970B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2020 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Jan 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/15
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure discloses a method for manufacturing an electronic device, including: setting a basic working area; providing a supporting platform having a plurality of vacuum valves; disposing a substrate on the supporting platform; applying vacuum attraction to a portion of the substrate through a portion of the plurality of vacuum valves, wherein the portion of the substrate corresponding to the vacuum attraction is defined as an attracted region; and performing an exposure on a portion of the attracted region, wherein an area of the attracted region is larger than the basic working area and smaller than an area of the supporting platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.