Yeong-E Chen
28Patents
3h-index
20Co-inventors
63Inventor score
Filing activity: Nov 16, 1998 → Sep 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6071762A | Process to manufacture LDD TFT | Electricity | 15 | Expired |
| US6433485B1 | Apparatus and method of testing an organic light emitting diode array | Physics | 13 | Expired |
| US6323034A | Amorphous TFT process | Electricity | 12 | Expired |
| US11398430B2 | Package device and a manufacturing method thereof | Electricity | 1 | Active |
| US11582865B2 | Package device | Electricity | 1 | Active |
| US11694999B2 | Electronic device and fabrication method thereof | Electricity | 1 | Active |
| US11551970B2 | Method for manufacturing an electronic device | Electricity | 1 | Active |
| US11406015B2 | Bonding pad structure | Electricity | 1 | Active |
| US12308289B2 | Method for manufacturing an electronic device | Electricity | 0 | Active |
| US12200857B2 | Package device | Electricity | 0 | Active |
| US11901315B2 | Package device | Electricity | 0 | Active |
| US12376224B2 | Package device | Electricity | 0 | Active |
| US12148686B2 | Package device and manufacturing method thereof | Electricity | 0 | Active |
| US12142554B2 | Electronic component and manufacturing method thereof | Electricity | 0 | Active |
| US11776914B2 | Package device | Electricity | 0 | Active |
| US11769685B2 | Manufacturing method of semiconductor package | Electricity | 0 | Active |
| US11812549B2 | Package device and manufacturing method thereof | Electricity | 0 | Active |
| US11798853B2 | Manufacturing method of package device | Electricity | 0 | Active |
| US12148630B2 | Method for manufacturing electronic device | Electricity | 0 | Active |
| US12266646B2 | Electronic device | Electricity | 0 | Active |
| US11378618B2 | Method for manufacturing electronic device having a seed layer on a substrate | Electricity | 0 | Active |
| US12224226B2 | Electronic device | Electricity | 0 | Active |
| US12050374B2 | Electronic device | Emerging Cross-Sectional Technologies | 0 | Active |
| US12354919B2 | Manufacturing method of package circuit | Electricity | 0 | Active |
| US12205854B2 | Electronic device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.