Method and apparatus for providing thermal wear leveling
US11551990B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2017 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | Aug 11, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.