High precision bonding apparatus comprising heater
US11552031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2020 |
| Grant date | Jan 10, 2023 |
| Priority date | — |
| Expiry date | May 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/73
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding apparatus includes a bond head structure, an optical unit and an actuator unit. The bond head structure includes a bond head collet, a connecting unit to which the bond head collet is attached and a look-through passage extending through the bond head collet and the connecting unit along a central axis of the bond head structure. In use, the bond head collet holds an electrical component to be bonded to a bonding area of a base member and the optical unit is positioned relative to the bond head structure to view and inspect the electrical component through the look-through passage of the bond head structure. The actuator unit moves the connecting unit of the bond head structure based on the inspection of the electrical component by the optical unit, to align the electrical component with the bonding area of the base member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.