Method for co-integration of III-V devices with group IV devices

US11557503B2 · kind B2 · utility

Assignee

• IMEC VZW · BE

Inventors

• Amey Mahadev Walke · Heverlee, BE
• Liesbeth Witters · Linden, BE

Key dates

• Filing date: Aug 18, 2020
• Grant date: Jan 17, 2023
• Expiry date: Aug 18, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D84/01
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The present disclosure relates to a semi-conductor structure and method for co-integrating a III-V device with a group IV device on a SixGe1-x(100) substrate. The method includes: (a) providing a SixGe1-x(100) substrate, where x is from 0 to 1; (b) selecting a first region for forming therein a group IV device and a second region for forming therein a III-V device, the first and the second region each comprising a section of the SixGe1-x(100) substrate; (c) forming a trench isolation for at least the III-V device; (d) providing a SiyGe1-y(100) surface in the first region, where y is from 0 to 1; (e) at least partially forming the group IV device on the SiyGe1-y(100) surface in the first region; (f) forming a trench in the second region which exposes the SixGe1-x(100) substrate, the trench having a depth of at least 200 nm, at least 500 nm, at least 1 μm, usually at least 2 μm, such as 4 μm, with respect to the SiyGe1-y(100) surface in the first region; (g) growing a III-V material in the trench using aspect ratio trapping; and (h) forming the III-V device on the III-V material, the III-V device comprising at least one contact region at a height within 100 nm, 50 nm, 20 nm, usually …