Patent · US Active

Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions

US11557529B2 · kind B2 · utility

0Cited by

30References

17Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Thomas A. Boyd
Ming-Chen Chang · Kaohsiung, TW
Evan A. Chenelly · Portland, US
Divya Swamy Bandaru · Hillsboro, US
Craig Jahne · Beaverton, US
Andrew Larson · Hillsboro, US
Eric W. Buddrius · Hillsboro, US
Eric D. McAfee · Portland, US
Mustafa H. Haswarey · Tigard, US
Ralph V. Miele · Hillsboro, US
Rolf Laido · Poway, US

Key dates

Filing date	Mar 30, 2018
Grant date	Jan 17, 2023
Priority date	—
Expiry date	May 17, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15323
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.