Patent · US Active

Leadframe for semiconductor devices, corresponding semiconductor product and method

US11557547B2 · kind B2 · utility

0Cited by

1References

22Claims

0Family size

Assignee

STMicroelectronics SA

Inventors

Roberto Tiziani · Milano, IT
Mauro MAZZOLA · Calvenzano, IT

Key dates

Filing date	Dec 18, 2020
Grant date	Jan 17, 2023
Priority date	—
Expiry date	Dec 18, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A leadframe for semiconductor devices, the leadframe comprising a die pad portion having a first planar die-mounting surface and a second planar surface opposed the first surface, the first surface and the second surface having facing peripheral rims jointly defining a peripheral outline of the die pad wherein the die pad comprises at least one package molding compound receiving cavity opening at the periphery of said first planar surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.