Roberto Tiziani
16Patents
4h-index
20Co-inventors
60Inventor score
Filing activity: Dec 15, 1998 → May 25, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6195256A | Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6909166B2 | Leads of a no-lead type package of a semiconductor device | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6815789B2 | Semiconductor electronic device and method of manufacturing thereof | Electricity | 7 | Expired |
| US6468356B1 | Method for removing molding residues in the fabrication of plastic packages for semiconductor devices | Electricity | 5 | Expired |
| US6291893A | "Power semiconductor device for ""flip-chip"" connections" | Electricity | 3 | Expired |
| US7459387B2 | Semiconductor electronic device and method of manufacturing thereof | Electricity | 2 | Expired |
| US6838755B2 | Leadframe for integrated circuit chips having low resistance connections | Electricity | 2 | Expired |
| US7803663B2 | Method for manufacturing a molded MMC multi media card package obtained with laser cutting | Physics | 1 | Active |
| US11557547B2 | Leadframe for semiconductor devices, corresponding semiconductor product and method | Electricity | 0 | Active |
| US11749588B2 | Semiconductor device and corresponding method | Electricity | 0 | Active |
| US12322603B2 | Method of manufacturing semiconductor devices and corresponding semiconductor device | Electricity | 0 | Active |
| US12040263B2 | Semiconductor device with die mounted to an insulating substrate and corresponding method of manufacturing semiconductor devices | Electricity | 0 | Active |
| US12322684B2 | Method of manufacturing electronic devices and corresponding electronic device | Electricity | 0 | Active |
| US6593665B2 | Protective envelope for a semiconductor integrated circuit | Electricity | 0 | Expired |
| US12381372B2 | Electronic module for generating light pulses for LIDAR applications and method for manufacturing the electronic module | Electricity | 0 | Active |
| US11626379B2 | Method of manufacturing semiconductor devices and corresponding semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.