Flip-chip flexible under bump metallization size
US11557557B2 · kind B2 · utility
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24Claims
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Key dates
| Filing date | Jun 30, 2020 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Sep 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a flip-chip device. The flip-chip device includes a die having a plurality of under bump metallizations (UBMs); and a package substrate having a plurality of bond pads. The plurality of UBMs include a first set of UBMs having a first size and a first minimum pitch and a second set of UBMs having a second size and a second minimum pitch. The first set of UBMs and the second set of UBMs are each electrically coupled to the package substrate by a bond-on-pad connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.