Structure of semiconductor device and method for bonding two substrates
US11557558B2 · kind B2 · utility
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2References
6Claims
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Key dates
| Filing date | Aug 4, 2020 |
| Grant date | Jan 17, 2023 |
| Priority date | — |
| Expiry date | Aug 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/80908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure of semiconductor device is provided, including a first circuit structure, formed on a first substrate. A first test pad is disposed on the first substrate. A second circuit structure is formed on a second substrate. A second test pad is disposed on the second substrate. A first bonding pad of the first circuit structure is bonded to a second bonding pad of the second circuit structure. One of the first test pad and the second test pad is an inner pad while another one of the first test pad and the second test pad is an outer pad, wherein the outer pad surrounds the inner pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.