Substrate processing chamber

US11560626B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Timothy Joseph Franklin · Campbell, US
• Adam J. Fischbach · Campbell, US
• Edward Haywood · San Jose, US
• Abhijit Basu Mallick · Palo Alto, US
• Pramit Manna · Sunnyvale, US
• Carlaton WONG · Sunnyvale, US
• Stephen C. Garner · Newark, US
• Eswaranand Venkatasubramanian · Santa Clara, US

Key dates

• Filing date: May 18, 2020
• Grant date: Jan 24, 2023
• Expiry date: May 18, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/0332
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present disclosure generally relate to apparatus and methods utilized in the manufacture of semiconductor devices. More particularly, embodiments of the present disclosure relate to a substrate processing chamber, and components thereof, for forming semiconductor devices.