Photoresist composition
US11561471B2 · kind B2 · utility
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5References
7Claims
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Key dates
| Filing date | Dec 7, 2016 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Dec 7, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/38
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photoresist composition comprising:a resin which has a structural unit represented by formula (I): wherein R1 represents a hydrogen atom, a halogen atom, or a C1 to C6 alkyl group which optionally has a halogen atom, and R2 represents a C1 to C42 hydrocarbon group which optionally has a substituent; an alkali-soluble resin;an acid generator; anda solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.