Patent · US Active

Method for transferring thin layers

US11562899B2 · kind B2 · utility

0Cited by

2References

19Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Pierre Montmeat · La Riche, FR
Frank Fournel · Meylan, FR

Key dates

Filing date	Dec 8, 2017
Grant date	Jan 24, 2023
Priority date	—
Expiry date	Jan 18, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68368
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for transferring a thin layer onto a destination substrate having a face with an adhesive layer includes formation of a polymer material interface layer on a second face of a thin layer, opposite a first face on which an adhesive is present. The method also includes assembly by gluing the interface layer and the adhesive layer and separation of the thin layer relative to a temporary support.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.