High density multiple die structure
US11562955B2 · kind B2 · utility
0Cited by
3References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 27, 2016 |
| Grant date | Jan 24, 2023 |
| Priority date | — |
| Expiry date | Dec 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods are provided for integrated circuit packages having a low z-height. In an example, a method can include mounting a first integrated circuit sub-package to a first package substrate wherein the sub-package substrate spans an opening of the first package substrate, mounting a second integrated circuit package to a second package substrate, and mounting the first package substrate with the second package substrate wherein the mounting includes locating a portion of the second integrated circuit package within the opening of the first package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.