Patent · US Active

Retaining ring

US11565367B2 · kind B2 · utility

0Cited by

9References

20Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Liam S. Roberts · Portland, US
Eric A. Bunn · San Jose, US

Key dates

Filing date	Jul 9, 2020
Grant date	Jan 31, 2023
Priority date	—
Expiry date	Jan 9, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/20
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A retaining ring used in the polishing of semiconductor substrates is described herein. A retaining ring includes a bottom surface configured to contact a polishing pad and a top surface configured to attach to a carrier head. The top surface includes a plurality of screw holes and a plurality of alignment slots. The top surface also includes a first insert disposed in a first alignment slot of the plurality of alignment slots, the first insert flush with or below the top surface, and where the first insert configured to prevent insertion of an alignment pin into the first alignment slot.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.