Substrate locking system, device and procedure for chemical and/or electrolytic surface treatment
US11566337B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2020 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Oct 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76841
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.