Patent · US Active

Temporary bonding method

US11569115B2 · kind B2 · utility

0Cited by

0References

12Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Pierre Montmeat · La Riche, FR
Frank Fournel · Meylan, FR
Laurent Bally · Saint-Georges-de-Commiers, FR
Thierry Enot · Grenoble, FR

Key dates

Filing date	Jun 8, 2021
Grant date	Jan 31, 2023
Priority date	—
Expiry date	Jul 31, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68381
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method of temporary bonding of an object having first and second opposite surfaces successively including bonding the object to a handle on the side of the first surface, bonding the object to a first adhesive film on the side of the second surface, bonding the first adhesive film to a second adhesive film on the side opposite to the object, and removing the handle from the object.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.