Component embedded in component carrier and having an exposed side wall
US11570897B2 · kind B2 · utility
0Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2018 |
| Grant date | Jan 31, 2023 |
| Priority date | — |
| Expiry date | Aug 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0228
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.