Polishing pad having excellent airtightness
US11571783B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Aug 6, 2018 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Nov 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/306
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An embodiment relates to a polishing pad which is used in a chemical mechanical planarization (CMP) process and has excellent airtightness, wherein the polishing pad is excellent in airtightness of a window opening and thus can prevent water leakage that may occur during a CMP process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.