Integrated sensor with reduced skew
US11573180B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2021 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Apr 7, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/6439
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Aspects of the present disclosure relate to techniques for reducing skew in an integrated device, such as a CMOS imaging device. In some aspects, multiple pixels of an integrated circuit may be configured to receive a same control signal and conduct charge carriers responsive to the control signal substantially at the same time. In some aspects, an integrated circuit may have modulated charge transfer channel voltage thresholds, such as by having different charge transfer channel lengths, and/or a doped portion configured to set a voltage threshold for charge transfer. In some aspects, an integrated circuit may have a via structure having a plurality of vias extending between continuous portions of at least two metal layers. In some aspects, an integrated circuit may include a row of pixels and a voltage source configured to provide a voltage to bias a semiconductor substrate of the integrated circuit along the row of pixels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.