Power module having an elevated power plane with an integrated signal board and process of implementing the same
US11574859B2 · kind B2 · utility
0Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2020 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Sep 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module includes at least one electrically conductive power substrate; and a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate. The power module further includes at least one elevated signal element electrically connected to the plurality of power devices and/or at least one elevated power plane electrically connected to the at least one electrically conductive power substrate and electrically connected to the plurality of power devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.