Method for fabricating a detection device comprising a step of direct bonding of a thin sealing layer provided with a getter material
US11575063B2 · kind B2 · utility
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13Claims
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Assignee
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Key dates
| Filing date | Nov 27, 2020 |
| Grant date | Feb 7, 2023 |
| Priority date | — |
| Expiry date | Nov 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/60
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a method for fabricating a thermal detector (1), comprising the following steps:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.