Low-silver alternative to standard SAC alloys for high reliability applications
US11577343B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2018 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Nov 15, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C13/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, and antimony. The alloy may further comprise nickel. The silver may be present in an amount from about 2.0% to 2.8% by weight of the solder. The copper may be present in an amount from about 0.2% to 1.2% by weight of the solder. The bismuth may be present in an amount from about 0.0% to about 5.0% by weight of the solder. In some embodiments, the bismuth may be present in an amount from about 1.5% to 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.001% to about 0.2% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.1% by weight of the solder. The balance of the solder is tin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.