Pad conditioner cut rate monitoring
US11577362B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2019 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Sep 20, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/9006
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning disk against the polishing surface, an in-situ polishing pad thickness monitoring system, and a controller. The controller is configured to store data associating each of a plurality of conditioner disk products with a respective threshold value, receive an input selecting a conditioner disk product from the plurality of conditioner disk products, determine a particular threshold value associated with the selected conditioner disk product, receive a signal from the monitoring system, generate a measure of a pad cut rate from the signal, and generate an alert if the pad cut rate falls beyond the particular threshold value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.