Wafer inspection system including a laser triangulation sensor
US11578967B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2018 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Jun 8, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One example of an inspection system includes a laser, a magnification changer, and a first camera. The laser projects a line onto a wafer to be inspected. The magnification changer includes a plurality of selectable lenses of different magnification. The first camera images the line projected onto the wafer and outputs three-dimensional line data indicating the height of features of the wafer. Each lens of the magnification changer provides the same nominal focal plane position of the first camera with respect to the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.