Probe card for efficient screening of highly-scaled monolithic semiconductor devices
US11579182B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2020 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Jan 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Enhanced probe cards, for testing unpackaged semiconductor die including numerous discrete devices (e.g., LEDs), are described. The die includes anodes and cathodes for the LEDs. Via a single touchdown event, the probe card may simultaneously operate each of the LEDs. The LEDs' optical output is measured and the performance of the die is characterized. The probe card includes a conductive first contact and another contact that are fabricated from a conformal sheet or film. Upon the touchdown event, the first contact makes contact with each of the die's anodes and the other contact makes contact with each of the die's cathodes. The vertical and sheet resistance of the contacts are sufficient such that the voltage drop across the vertical dimension of the contacts is approximately an order of magnitude greater than the operating voltage of the LEDs and current-sharing between adjacent LEDs is limited by the sheet resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.