Patent · US Active

Process kit having tall deposition ring and smaller diameter electrostatic chuck (ESC) for PVD chamber

US11581167B2 · kind B2 · utility

1Cited by

2References

20Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

David Gunther · Weingarten, DE
Siew Kit Hoi · Singapore, SG
Kirankumar Neelasandra SAVANDAIAH · Bengaluru, IN

Key dates

Filing date	Jun 18, 2021
Grant date	Feb 14, 2023
Priority date	—
Expiry date	Jun 18, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/332
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Embodiments of process kits are provided herein. In some embodiments, a process kit, includes: a deposition ring configured to be disposed on a substrate support, the deposition ring comprising: an annular band having an upper surface and a lower surface, the lower surface including a step between a radially inner portion and a radially outer portion, the step extending downward from the radially inner portion to the radially outer portion; an inner lip extending upwards from the upper surface of the annular band and adjacent an inner surface of the annular band, and wherein an outer surface of the inner lip extends radially outward and downward from an upper surface of the inner lip to the upper surface of the annular band; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.