Processing apparatus
US11581198B2 · kind B2 · utility
0Cited by
2References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 7, 2020 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Nov 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a processing apparatus including: a processing part including a plurality of process modules connected to each other in a first room, and a loader module provided in the first room and accommodating a carrier which receives a substrate processed by each of the plurality of process modules; and a plurality of pump units corresponding to the plurality of process modules, respectively, and arranged in a second room adjacent to the first room, wherein an installation area of the plurality of pump units is equal to or smaller than that of the processing part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.