Wafer drying system
US11581199B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2019 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Aug 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer drying method that detects molecular contaminants in a drying gas as a feedback parameter for a multiple wafer drying process is disclosed. For example, the method includes dispensing, in a wafer drying module, a drying gas over a batch of wafers. Further, the method includes collecting the drying gas from an exhaust of the wafer drying module and determining the concentration of contaminants in the drying gas. The method also includes re-dispensing the drying gas over the batch of wafers if the concentration of contaminants is greater than a baseline value and transferring the batch of wafers out of the wafer drying module if the concentration is equal to or less than the baseline value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.