Electrostatic chuck having a cooling structure
US11581211B2 · kind B2 · utility
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1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2020 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Apr 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is an electrostatic chuck with a cooling structure using a cooling gas. The electrostatic chuck comprises: an electrostatic chuck plate that includes a plurality of first cooling gas holes formed in a first region and a plurality of second cooling gas holes formed in a second region; and a base member that includes a first flow path pattern connected to the plurality of first cooling gas holes, a second flow path pattern connected to the plurality of second cooling gas holes, and an inlet moving pattern changing a position of an inlet of a cooling gas injected into the first flow path pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.