Cooling apparatuses for microelectronic assemblies
US11581237B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2018 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Jun 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the surface of the package substrate; and a cooling apparatus that may include a conductive base having a first surface and an opposing second surface, wherein the first surface of the conductive base is in thermal contact with the second surface of the die, and a plurality of conductive structures on the second surface of the conductive base, wherein an individual conductive structure of the plurality of conductive structures has a width between 10 microns and 100 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.