Package comprising a die and die side redistribution layers (RDL)
US11581262B2 · kind B2 · utility
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30Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 2, 2019 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Jun 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package that includes a second redistribution portion, a die coupled to the second redistribution portion, an encapsulation layer encapsulating the die, and a first redistribution portion coupled to the second redistribution portion. The first redistribution portion is located laterally to the die. The first redistribution portion is located over the second redistribution portion. The first redistribution portion and the second redistribution portion are configured to provide one or more electrical paths for the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.