Serializer-deserializer die for high speed signal interconnect
US11581282B2 · kind B2 · utility
10Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2018 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | Jun 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In embodiments, a semiconductor package may include a first die and a second die. The package may additionally include a serializer/deserializer (SerDes) die coupled with the first and the second dies. The SerDes die may be configured to serialize signals transmitted from the first die to the second die, and deserialize signals received from the second die. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.