Package device
US11582865B2 · kind B2 · utility
1Cited by
0References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2021 |
| Grant date | Feb 14, 2023 |
| Priority date | — |
| Expiry date | May 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4682
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer including a first dielectric layer, a conductive layer, and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the conductive patterns are arranged in a ring shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.