Multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system
US11585764B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2021 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Dec 9, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R27/32
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for multi-level RF pulse monitoring and RF pulsing parameter optimization at a manufacturing system are provided. A radio frequency (RF) signal is pulsed within a processing chamber in accordance with a set of RF pulsing parameters. Sensor data is received from one or more sensors that indicates a multi-level RF pulse waveform detected within the processing chamber based on the RF signal pulsing. One or more peaks are identified in the detected multi-level RF pulse waveform. Each identified peak corresponds to at least one RF signal pulse of the RF signal pulsing within the processing chamber. A determination is made, based on the identified one or more peaks, whether the detected multi-level RF pulse waveform corresponds to the target multi-level RF pulse waveform. An indication of whether the detected multi-level RF pulse waveform corresponds to the target multi-level RF pulse waveform is provided to a client device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.