Component mounting system
US11587804B2 · kind B2 · utility
3Cited by
2References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 31, 2018 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Dec 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0409
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.