BONDTECH CO., LTD.
19Patents
18Active
19Granted
53Portfolio score
Filing activity: Dec 2, 2004 → Oct 14, 2023 · 2 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9142532B2 | Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer | Electricity | 20 | Active |
| US7645681B2 | Bonding method, device produced by this method, and bonding device | Electricity | 8 | Expired |
| US7784670B2 | Joining method and device produced by this method and joining unit | Electricity | 7 | Active |
| US8091764B2 | Joining method and device produced by this method and joining unit | Electricity | 7 | Active |
| US9601350B2 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Electricity | 6 | Active |
| US9870922B2 | Substrate bonding apparatus and substrate bonding method | Electricity | 4 | Active |
| US9243894B2 | Pressure application apparatus and pressure application method | Emerging Cross-Sectional Technologies | 4 | Active |
| US11587804B2 | Component mounting system | Electricity | 3 | Active |
| US10580752B2 | Method for bonding substrates together, and substrate bonding device | Electricity | 3 | Active |
| US9379082B2 | Pressure application apparatus and pressure application method | Emerging Cross-Sectional Technologies | 1 | Active |
| US10204785B2 | Substrate bonding apparatus and substrate bonding method | Electricity | 1 | Active |
| US12261147B2 | Bonding system and bonding method | Electricity | 0 | Active |
| US11837444B2 | Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device | Electricity | 0 | Active |
| US12261070B2 | Component mounting system and component mounting method | Electricity | 0 | Active |
| US12341036B2 | Resin shaping device | Electricity | 0 | Active |
| US12409644B2 | Substrate bonding method and substrate bonding system | Performing Operations; Transporting | 0 | Active |
| US12388045B2 | Bonding system and bonding method | Electricity | 0 | Active |
| US8651363B2 | Joining method and device produced by this method and joining unit | Electricity | 0 | Active |
| US12094747B2 | Substrate bonding device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.