Protective coating for plasma dicing
US11587834B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 6, 2021 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Jun 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/5446
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for an improved protective coating for plasma dicing a substrate. A work piece having a support film, a frame and the substrate, the substrate having a top surface and a bottom surface, the top surface of the substrate having a plurality of device structures and a plurality of street areas is provided. The work piece is formed by adhering the substrate to a support film and then mounting the substrate with the support film to a frame. A composite material coating having a matrix component and a filler component is applied to the top surface of the substrate. The filler component has a plurality of particles. The composite material coating is removed from at least one street area to expose the street area. The exposed street area is plasma etched. The composite material coating is removed from the top surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.