Russell Westerman
47Patents
6h-index
27Co-inventors
69Inventor score
Filing activity: Nov 30, 2001 → Mar 8, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6924235B2 | Sidewall smoothing in high aspect ratio/deep etching using a discrete gas switching method | Electricity | 19 | Expired |
| US8785332B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 14 | Active |
| US8802545B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 11 | Active |
| US8691702B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 8 | Active |
| US6544696B2 | Embedded attenuated phase shift mask and method of making embedded attenuated phase shift mask | Physics | 7 | Expired |
| US8778806B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 7 | Active |
| US7101805B2 | Envelope follower end point detection in time division multiplexed processes | Performing Operations; Transporting | 6 | Expired |
| US9711406B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 5 | Active |
| US6905626B2 | Notch-free etching of high aspect SOI structures using alternating deposition and etching and pulsed plasma | Electricity | 5 | Expired |
| US6982175B2 | End point detection in time division multiplexed etch processes | Electricity | 5 | Expired |
| US7381650B2 | Method and apparatus for process control in time division multiplexed (TDM) etch processes | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7713432B2 | Method and apparatus to improve plasma etch uniformity | Electricity | 3 | Expired |
| US9082839B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 3 | Active |
| US9070760B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 2 | Active |
| US7115520B2 | Method and apparatus for process control in time division multiplexed (TDM) etch process | Emerging Cross-Sectional Technologies | 2 | Expired |
| US8796154B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Emerging Cross-Sectional Technologies | 2 | Active |
| US6846747B2 | Method for etching vias | Emerging Cross-Sectional Technologies | 2 | Expired |
| US9343365B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 1 | Active |
| US10818552B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 1 | Active |
| US7959819B2 | Method and apparatus for reducing aspect ratio dependent etching in time division multiplexed etch processes | Electricity | 1 | Active |
| US9911654B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 1 | Active |
| US9105705B2 | Method and apparatus for plasma dicing a semi-conductor wafer | Electricity | 1 | Active |
| US7867403B2 | Temperature control method for photolithographic substrate | Electricity | 1 | Active |
| US7008877B2 | Etching of chromium layers on photomasks utilizing high density plasma and low frequency RF bias | Electricity | 1 | Expired |
| US11587834B1 | Protective coating for plasma dicing | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.