Electronic package and manufacturing method thereof
US11587892B2 · kind B2 · utility
1Cited by
0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2021 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Jun 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.