Semiconductor packages having vias
US11587898B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2020 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Feb 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a lower redistribution layer including an insulating pattern having an opening and a via in the opening; a first semiconductor chip including a chip pad, a passivation layer, and a pad bump connected to the chip pad; and a first encapsulant on the lower redistribution layer and the first semiconductor chip. The opening defines a lower surface and a side surface of the pad bump, and the via is in physical contact with the lower surface and the side surface of the pad bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.