Changeun Joo
8Patents
1h-index
7Co-inventors
33Inventor score
Filing activity: Dec 4, 2019 → Feb 17, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11990439B2 | Semiconductor package including under bump metallization pad | Electricity | 1 | Active |
| US11373955B2 | Semiconductor package and method of manufacturing the semiconductor package | Electricity | 1 | Active |
| US11587898B2 | Semiconductor packages having vias | Electricity | 0 | Active |
| US11961812B2 | Semiconductor packages having vias | Electricity | 0 | Active |
| US11264339B2 | Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package | Electricity | 0 | Active |
| US11978696B2 | Semiconductor package device | Electricity | 0 | Active |
| US11972966B2 | Method of manufacturing a semiconductor package including correcting alignment error while forming redistribution wiring struture | Electricity | 0 | Active |
| US11810864B2 | Semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.