Package structures having underfills
US11587906B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2021 |
| Grant date | Feb 21, 2023 |
| Priority date | — |
| Expiry date | Apr 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/1005
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a lower substrate, substrate connection terminals on the lower substrate, a semiconductor package on the substrate connection terminals, the semiconductor package including a package substrate and a first encapsulant covering the package substrate, first underfills between the lower substrate and the semiconductor package, the first underfills covering corner portions of the semiconductor package, as viewed in a plan view, and covering at least one of the substrate connection terminals, and a second underfill between the lower substrate and the semiconductor package, the second underfill covering a side surface of the semiconductor package in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.