Inventor · Hwaseong-si, KR

Teakhoon Lee

13Patents

2h-index

23Co-inventors

50Inventor score

Filing activity: Jun 13, 2012 → Feb 16, 2023

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9245787B2	Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same	Emerging Cross-Sectional Technologies	6	Active
US11462462B2	Semiconductor packages including a recessed conductive post	Electricity	2	Active
US11587906B2	Package structures having underfills	Electricity	0	Active
US12355004B2	Semiconductor chip and semiconductor package	Electricity	0	Active
US11362062B2	Semiconductor package	Electricity	0	Active
US11967581B2	Package structures having underfills	Electricity	0	Active
US12176313B2	Semiconductor package	Electricity	0	Active
US11791282B2	Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same	Electricity	0	Active
US12237240B2	Semiconductor package and method of manufacturing semiconductor package	Electricity	0	Active
US11923340B2	Semiconductor package including mold layer and manufacturing method thereof	Electricity	0	Active
US12218096B2	Semiconductor package and method of forming the same	Electricity	0	Active
US11791308B2	Semiconductor package	Electricity	0	Active
US11705323B2	Wafer trimming device	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.