Methods of incorporating leaker devices into capacitor configurations to reduce cell disturb, and capacitor configurations incorporating leaker devices

US11587938B2 · kind B2 · utility

Assignee

• Micron Technology, Inc. · US

Inventors

• Michael Mutch · Chardon, US
• Sanket S. Kelkar · Boise, US
• Ashonita A. Chavan · Boise, US
• Sameer Chhajed · Boise, US
• Adriel Jebin Jacob Jebaraj · Boise, US

Key dates

• Filing date: Jun 10, 2020
• Grant date: Feb 21, 2023
• Expiry date: Jun 10, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D1/682

Abstract

Some embodiments include a capacitor having a container-shaped bottom portion. The bottom portion has a first region over a second region. The first region is thinner than the second region. The first region is a leaker region and the second region is a bottom electrode region. The bottom portion has an interior surface that extends along the first and second regions. An insulative material extends into the container shape. The insulative material lines the interior surface of the container shape. A conductive plug extends into the container shape and is adjacent the insulative material. A conductive structure extends across the conductive plug, the insulative material and the first region of the bottom portion. The conductive structure directly contacts the insulative material and the first region of the bottom portion, and is electrically coupled with the conductive plug. Some embodiments include methods of forming assemblies.