Mega-sonic vibration assisted chemical mechanical planarization
US11590627B2 · kind B2 · utility
1Cited by
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20Claims
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Key dates
| Filing date | Jul 18, 2019 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Dec 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of performing a chemical mechanical planarization (CMP) process includes holding a wafer by a retainer ring attached to a carrier, pressing the wafer against a first surface of a polishing pad, the polishing pad rotating at a first speed, dispensing a slurry on the first surface of the polishing pad, and generating vibrations at the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.