Thermal switch for rapid thermal coupling and decoupling of devices under test
US11592472B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2019 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Apr 9, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2877
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for testing integrated circuits (ICs) , includes a first thermal contact structure having a first surface to interface with a heat source and an opposing second surface to interface with a device under test (DUT). A second thermal contact structure is above the first thermal contact structure and separated therefrom by a variable-resistance thermal interface (VRTI) structure operable to couple or decouple the first and second thermal contact structures from one another. The VRTI structure has a maximal thermal conductivity associated with a first state, and a minimal thermal conductivity associated with a second state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.