Positive-type photosensitive resin composition
US11592744B2 · kind B2 · utility
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Key dates
| Filing date | Feb 5, 2016 |
| Grant date | Feb 28, 2023 |
| Priority date | — |
| Expiry date | Aug 5, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) polybenzoxazole precursor comprises a structure represented by Formula (1) below, and the (c) photosensitive agent is a compound comprising a structure represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.