Patent · US Active

Method for producing a semiconductor module arrangement

US11596077B2 · kind B2 · utility

0Cited by

17References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Patrick Jones · Kirkwood, US
Christoph Koch · Salzkotten, DE
Michael Sielaff · Erwitte, DE

Key dates

Filing date	Dec 29, 2017
Grant date	Feb 28, 2023
Priority date	—
Expiry date	Dec 20, 2038

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49208
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method of producing a semiconductor module arrangement includes providing a first subassembly having a number N1 of first adjustment openings, a second subassembly having a number N2 of second adjustment openings and a third subassembly having a plurality of adjustment pins which are fixedly connected to one another, the first subassembly, the second subassembly and the third subassembly being independent of one another and not connected to one another. The first subassembly, the second subassembly and the third subassembly are arranged relative to one another in such a way that each of the adjustment pins engages into one of the first adjustment openings and/or into one of the second adjustment openings.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.